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LEDMAN
COB (Chip on Board)
Ledman COB (Chip on Board) displays mount the LED chips directly and seal them under a flat protective layer — a packaging approach chosen for durable, seamless fine-pitch walls where viewers stand close, such as boardrooms, control rooms and premium lobbies.
The encapsulated surface resists knocks and handling better than exposed-emitter packaging and presents a smooth, low-glare image, which is why COB is favoured for high-touch, close-viewing installations.
AVSTEK specifies COB pitch to your room and viewing distance and integrates the wall with processing, control and network as one commissioned, serviceable system rather than a stand-alone panel.
Ledman COB (Chip on Board) displays mount the LED chips directly and seal them under a flat protective layer — a packaging approach chosen for durable, seamless fine-pitch walls where viewers stand close, such as boardrooms, control rooms and premium lobbies.
The encapsulated surface resists knocks and handling better than exposed-emitter packaging and presents a smooth, low-glare image, which is why COB is favoured for high-touch, close-viewing installations.
AVSTEK specifies COB pitch to your room and viewing distance and integrates the wall with processing, control and network as one commissioned, serviceable system rather than a stand-alone panel.
LED packaging technology in which the LED chip is mounted directly onto the PCB.
Supports small pixel pitch, high resolution and close viewing distance.
Improves heat dissipation, reduces electrical resistance and improves energy efficiency.
The display surface offers better protection: dust, moisture, static and impact resistance.
Suitable for high-end indoor displays, command centers, conference and exhibition use.