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LEDMAN
COB (Chip on Board)
COB (Chip on Board) is an LED packaging technology where the LED chips are directly mounted onto the circuit board, enabling a higher pixel density and supporting high-resolution LED displays. At Ledman, COB technology is used in series such as the YF Series, BF Series, and DS Series, focusing on UHD image quality, high contrast, uniform black levels, and improved surface durability compared to traditional SMD LEDs.
COB (Chip on Board) is an LED packaging technology where the LED chips are directly mounted onto the circuit board, enabling a higher pixel density and supporting high-resolution LED displays. At Ledman, COB technology is used in series such as the YF Series, BF Series, and DS Series, focusing on UHD image quality, high contrast, uniform black levels, and improved surface durability compared to traditional SMD LEDs.
LED packaging technology where the LED chip is directly mounted onto the PCB.
Supports small pixel pitch, high resolution, and close viewing distances.
Enhances heat dissipation, reduces resistance, and improves energy efficiency.
Provides better protection for the display surface: resistant to dust, moisture, static electricity, and impacts.
Suitable for high-end indoor displays, command centers, conferences, and exhibitions.